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careers@nuvacore.aiPCB Design Layout Engineer
WHAT YOU’LL OWN
- End-to-End Layout: Own the complete physical design, floor planning, and component placement of high-speed, high-density PCBs from concept to mass production using Cadence Allegro 23.1 and Capture.
- Advanced Board Architecture: Engineer complex multi-layer stack-ups for data centers, AI systems, reference servers, and test platforms, integrating application processors, RF circuits, and power delivery networks.
- Optimization & Integrity: Optimize high-speed signal routing and critical power planes while maintaining topology, signal integrity (SI), and power integrity (PI).
- Constraints & Compliance: Manage design constraints and ensure strict adherence to EMI/RFI controls, IPC specifications, and global regulatory standards (FCC, UL, NRC, European regulations).
- Cross-Functional Collaboration: Partner with hardware, mechanical, and thermal engineers to resolve physical design issues and ensure layouts meet all technical specifications.
- Manufacturing Deliverables: Generate comprehensive manufacturing and assembly packages (Gerber, ODB++) to ensure a smooth transition into production.
REQUIREMENTS — MUST HAVE
- Education & Experience:S.E.E., Computer Science degree, or equivalent experience, with 8+ years of industry experience; high-speed PCB design experience is a plus.
- Technical Layout Knowledge: Strong understanding of High-Density Interconnect (HDI) PCB layout, signal integrity, and design considerations for layout, routing, and timing constraints.
- DFx & Manufacturing Tools: Solid grasp of DFM, DFA, and DFT constraints in volume manufacturing, with hands-on DFM analysis experience using Valor and/or CAM350.
REQUIREMENTS — nice to HAVE
- Advanced High-Speed Design: Extensive experience with high-speed, high-power physical design, complex stack-ups, and high-speed digital circuits (DDR/LPDDR, PCIe, USB breakouts).
- Software Mastery: Strong, demonstrated expertise in Cadence Allegro PCB design software.
- Problem Solving & Trade-offs: Expert understanding of PCB fabrication and assembly limitations, with the ability to propose cost-effective design trade-offs to meet scheduling and engineering requirements.
- Vendor & Cross-Functional Coordination: Experience maintaining technical alignment with engineering and manufacturing, and directly resolving design issues with fabrication and assembly vendors.
- Domain Knowledge: Deep familiarity with PCB layers (copper, silkscreen, solder mask), component models (symbols, footprints), and manufacturing trends.
- Multidisciplinary Basics: Foundational knowledge of mechanical, thermal, signal integrity (SI), and power integrity (PI) engineering principles.