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careers@nuvacore.aiMechanical Stress Analysis Engineer
WHAT YOU’LL OWN
- Lead advanced FEA simulation to evaluate the thermomechanical behavior, warpage, and structural integrity of 2.5D/3D packages (e.g., chiplets, silicon interposers, and hybrid bonding).
- Model complex material behaviors, including nonlinear, time-dependent effects like creep, fatigue, and viscoelasticity under high-temperature data center workloads.
- Establish modeling standards and best practices to improve simulation accuracy and speed up design sign-off.
- Drive simulation-to-test correlation, matching FEA results with physical reliability testing (TCT, drop testing) to ensure high predictive accuracy.
- Lead root-cause analysis for mechanical and reliability failures, guiding cross-functional teams toward robust design solutions.
- Influence early-stage product design by providing data-driven recommendations, risk assessments, and material selection criteria.
- Shape future packaging roadmaps by evaluating the structural limits and manufacturing readiness of new materials and fine-pitch interconnect concepts.
REQUIREMENTS — MUST HAVE
- Education & Experience: MS or PhD in Mechanical Engineering, Materials Science, or a related field with 5+ years of hands-on FEA modeling and simulation experience.
- Simulation Expertise: Deep proficiency in FEA tools (ANSYS or Abaqus), specifically for advanced thermomechanical simulation and nonlinear material modeling (viscoelasticity, creep, and fatigue).
- Advanced Packaging Knowledge: Practical understanding of advanced semiconductor packaging architectures (flip-chip, 2.5D/3D IC, CoWoS-S/R/L, Co-Packaged Optics, and high-density substrates).
- Reliability Engineering: Strong track record in solder joint reliability (SJR), micro-bump/hybrid-bond integrity, and knowledge of thermal-mechanical failure modes (warpage, delamination, and silicon-low-k interactions).
- Standards & Testing: Familiarity with JEDEC reliability standards and accelerated life testing methodologies (e.g., TCT, drop, vibration).
- Leadership & Impact: Demonstrated ability to drive data-backed technical decisions and collaborate effectively across global, cross-functional engineering teams.
REQUIREMENTS — nice to HAVE
- System-Level Modeling: Specialized expertise in Board-Level Reliability (BLR), PCB-package interaction, and large-form-factor data center hardware assemblies.
- Advanced Correlation: Proven track record of successfully correlating complex simulation models with empirical physical test data to achieve design sign-off.
- AI/HPC Architecture Familiarity: Deep understanding of the unique structural challenges associated with high-power AI accelerators, massive chiplet integration, and extreme thermal environments.
- Industry Standards: Advanced knowledge of IPC and JEDEC qualification standards for high-performance computing (HPC) environments.